Method for manufacturing a semiconductor device, stencil mask and method for manufacturing a the same

ABSTRACT

Preparing a stencil mask comprising a silicon thin film in which an opening for selectively irradiating charged particles to a semiconductor substrate is provided and whose irradiation surface on which the charged particles are irradiated is implanted with an impurity, and selectively irradiating charged particles to the semiconductor substrate using the stencil mask which is opposingly arranged on the semiconductor substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Applications No. 2000-333914, filed Oct. 31,2000; and No. 2001-290118, filed Sep. 21, 2001, the entire contents ofboth of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to method for manufacturing asemiconductor device using a stencil mask, a stencil mask used themethod for manufacturing a semiconductor device, and method formanufacturing the stencil mask.

2. Description of the Related Art

There is a method in which a stencil mask (or an aperture) having anopening is set at a certain distance on a substrate and an ionimplantation is carried out, in a manufacturing process of asemiconductor device, in a process where a MOSFET in which itselectrically conductive types of a channel within the same substrate aredifferent or a MOSFET in which its threshold voltages are different ismanufactured, when an ion implantation of an impurity is carried outinto a well, a channel or Poly-Si.

In the case where a stencil mask is used in the ion implantation processin the manufacturing for a semiconductor device, it is carried out byemploying a stencil mask having an opening limited to a region for ionimplantation of the object of a substrate to be processed. Specifically,in the desired ion implantation region, ions are implanted through theopening of a stencil mask, and in a region for non-ion implantation,ions are shielded by a stencil mask shielding portion. However, on thestencil mask for shielding an ion, shielded ions are accumulated byrepetitive ion implantations. Damages are also accumulated by shieldedions repeatedly crushing. As a result, after a plurality of ionimplantation processes, the stencil mask is deformed and the ionimplantation cannot be carried out with a high precision for positions.

For example, as shown in FIG. 39, when an impurity ion 4204 is implantedinto a Si substrate 4201 on which an isolation region 4202 is formedthrough the opening of a stencil mask 4203 interspatially installed, ifa distortion is generated on the stencil mask 4203, since the positionof the opening is displaced, an ion implantation region 4205 is notformed over the whole desired region, and a non-ion implantation region4206 is formed. Moreover, depending on the shape of rough coatingpattern, a problem is occurred that an n-type impurity is implanted overto a region in which a p-type region is to be formed.

As a result, the electric characteristics of a manufacturedsemiconductor product are varied, or the product poorly operates.Therefore, a stencil mask becomes unusable after it is used in theprocess of a plurality of ion implantations. The cost of manufacturing astencil mask is converted to the cost of a manufacturing a semiconductordevice, it leads to the rise of the manufacturing cost of thesemiconductor device.

Moreover, in the case of a stencil mask employing a SOI substrate, sinceit is shielded by a thin film portion region having an opening and asupporting portion for supporting the thin film portion region in whichthe oxide film is an insulating film, its electrical conductivity andthermal conductivity are poor, and when it is used in the manufacturingprocess of a semiconductor, there has been a problem that thedeformation due to the heat occurs or the ability of pattern formationis lowered due to the accumulation of charges.

By the way, in the manufacturing for a semiconductor device employingcharged particles represented by ion implantation process, it isrequired that the desired particles uniformly reach to the region of theobject. Therefore, it is needed that the uniformity is confirmed, thatis, the amount of particles is measured by spatial separation, and whenit does not have the desired uniformity, the uniformity should bemaintained by performing the adjustment of the particle generationsource within the apparatus for manufacturing a semiconductor device andthe transport system of the particles on the basis of the measuredsignal. Moreover, in order to maintain the uniformity of the processingstate among a plurality of processing substrates, it is required thatthe amount of particles reaching to the processing substrate is finelyand precisely measured.

For the confirmation of this uniformity and the definition of the numberof the particles reached to the substrate, there is a method ofconfirming the state of the substrate to be processed using anothermeasurement device by actually performing the processing to thesubstrate to be processed. However, in this case, since the time istaken from the processing to the measurement, it is difficult tore-adjust the device on the basis of the result.

Therefore, it is desirable that the measurement for the uniformity isperformed within the device, the re-adjustment of the device isperformed on the basis of the measurement of the results and theuniformity is measured again. For the measurement of the uniformitywithin the device, there is a method of evaluating the uniformity bymeasuring the output from the probes, for example, such as Faradaygauges or the like arranged in lines for measuring the electric chargeamount of the particles passing through the specific region.

However, since these probes measure the valence electrons, anyinformation concerning with the neutralized particles cannot beobtained. On the other hand, for example, in the ion implantationprocess, an ion may be neutralized due to the influence of the residualgas in the device, and the neutralized particles also act similarly asthe ion does to the substrate to be processed. Therefore, a probecapable of measuring particles including the neutral particles has beenrequired. Moreover, it has been desired that the spatial resolution isenhanced upon the measurement along with the miniaturization andrefinement of a semiconductor element, however, it has been difficult tominiaturize a probe for it.

As described above, it has been desired that in-plane distribution ofthe number of the neutral particles and the charged particles reached tothe semiconductor substrate is measured and the number of particlesreached to the semiconductor substrate is precisely controlled.

As described above, in the case where a stencil mask is used in the ionimplantation process a plurality of times, the distortion of the mask isgenerated, and the ion implantation position with respect to thesemiconductor substrate is deviated, thereby making the electriccharacteristics of the semiconductor products to be varied or making theproduct poorly operate. Therefore, in order to lower the manufacturingcost of the semiconductor device, a stencil mask capable of being madein a cheap cost or a stencil mask having a long life has been desired.

Moreover, there has been a problem that an ability of pattern formationis lowered due to the deformation with heat and the accumulation ofelectric charges caused by electrification.

A device for measurement capable of measuring an in-plane distributionof the number of the neutral particles and the charged particles reachedto the substrate has been required.

BRIEF SUMMARY OF THE INVENTION

The present invention is configured so as to achieve the above-describedobjects as the followings.

(1) According to one aspect of the present invention, there is provideda method for manufacturing a semiconductor device comprising: a methodfor manufacturing a semiconductor device comprising: preparing a stencilmask comprising a silicon thin film in which an opening for selectivelyirradiating charged particles to a semiconductor substrate is providedand whose irradiation surface on which the charged particles areirradiated is implanted with an impurity; and selectively irradiatingcharged particles to the semiconductor substrate using the stencil maskwhich is opposingly arranged on the semiconductor substrate.

(2) According to one aspect of the present invention, there is provideda method for manufacturing a semiconductor device comprising: preparinga stencil mask comprising a metal thin film in which an opening forselectively irradiating charged particles to a semiconductor substrateis formed and a semiconductor layer formed on an irradiation surface ofthe metal thin film on which the charged particles are irradiated; andselectively irradiating charged particles to a semiconductor substrateusing the stencil mask which is opposingly arranged on the semiconductorsubstrate.

(3) According to one aspect of the present invention, there is provideda method for manufacturing a semiconductor device comprising: preparinga stencil mask comprising a thin film in which an opening forselectively irradiating charged particles to a semiconductor substrateis formed and a plurality of covering layers formed on a surface of thethin film; and selectively irradiating charged particles to asemiconductor substrate using the stencil mask which is opposinglyarranged on the semiconductor substrate.

(4) According to one aspect of the present invention, there is provideda method for manufacturing a semiconductor device comprising: preparinga stencil mask comprising a silicon thin film in which an opening forselectively irradiating charged particles to a semiconductor substrateis formed and an insulating layer formed on an irradiation surface ofthe silicon thin film on which the charged particles are irradiated; andselectively irradiating charged particles to a semiconductor substrateusing the stencil mask which is opposingly arranged on the semiconductorsubstrate.

(5) According to one aspect of the present invention, there is provideda method for manufacturing a semiconductor device comprising: preparinga stencil mask comprising a shielding film in which an opening forselectively irradiating charged particles to a semiconductor substrateis formed and an resist film formed on an irradiation surface of theshielding film on which the charged particles are irradiated; andselectively irradiating charged particles to a semiconductor substrateusing the stencil mask which is opposingly arranged on the semiconductorsubstrate.

(6) According to one aspect of the present invention, there is provideda method for manufacturing a semiconductor device comprising:selectively forming a first resist film on an irradiation surface of theshielding film on which charged particles are irradiated to a stencilmask having the shielding film in which an opening through which chargedparticles pass is provided; selectively irradiating charged particles toone or more sheets of semiconductor substrates using the stencil maskcomprising the first resist film; removing a resist formed on anirradiation surface of the stencil mask; selectively forming a secondresist film on an irradiation surface-of the shielding film on which thecharged particles are irradiated; and selectively irradiating chargedparticles to the semiconductor substrate once or more.

(7) According to one aspect of the present invention, there is provideda method for manufacturing a semiconductor device comprising: preparinga stencil mask comprising a thin film provided with an opening forselectively irradiating charged particles to a semiconductor substrate,depth of the opening being different corresponding to the size of theopening; and selectively irradiating charged particles to asemiconductor substrate using the stencil mask which is opposinglyarranged on the semiconductor substrate.

(8) According to one aspect of the present invention, there is provideda method for manufacturing a semiconductor device comprising: preparinga stencil mask comprising a thin film in which an opening forselectively irradiating charged particles to a semiconductor substrateis provided, an insulating layer which is formed on an irradiationsurface of the thin film on which the charged particles are irradiatedand a supporting substrate which is formed on the thin film and theinsulating layer and which is conductive to the thin film; selectivelyirradiating charged particles to the semiconductor substrate using thestencil mask which is opposingly arranged on a semiconductor substrate;and discharging the charged particles attached to the thin film from thestencil mask via the supporting substrate by irradiation of the chargedparticles.

(9) According to one aspect of the present invention, there is provideda method for manufacturing a semiconductor device comprising:selectively implanting ions to a semiconductor substrate by irradiatingcharged particles to the semiconductor substrate via a stencil maskcomprising a thin film opposingly arranged on the semiconductorsubstrate and having an opening; and adjusting a potential differencebetween the thin film and the semiconductor substrate during irradiationof the charged particles.

(10) According to one aspect of the present invention, there is provideda method for manufacturing a semiconductor device in which particle beamincluding ions and neutral particles of impurity are irradiated to asemiconductor substrate installed at an irradiation position and animpurity of implantation amount D per unit area is implanted to thesemiconductor substrate, the method comprising: irradiating the particlebeam to a particle amount measurement device comprising an electrongeneration/discharging device which is installed nearby the irradiationposition in a state where the semiconductor substrate is not irradiatedby the particle beam and which generates and amplifies electronscorresponding to an incident position of ions and neutral particlesincident to a measurement surface and discharges the electrons from backsurface side, an electron detector for measuring a position and anamount of electrons discharged from the electron generation/dischargingdevice, and a particle amount calculation section for calculating adistribution of total particle amount of ions and neutral particlesincident to a surface of the particle detector from positions and amountof electrons measured by the electron detector and irradiating theparticle beam and to a beam current measurement device installed at aposition different from the irradiation position for measuring currentby the ions; measuring an in-plane distribution of a total particleamount of the ions and neutral particles of particle beam irradiated tothe electron generation/discharging device using the particle amountmeasurement device; controlling an in-plane distribution of a totalparticle amount by adjusting a generating system for generating theparticle beam and a transporting system through which the generatedparticle beam pass; moving the semiconductor substrate to theirradiation position; and irradiating the particle beam to thesemiconductor substrate.

(11) According to one aspect of the present invention, there is provideda method for manufacturing a semiconductor device in which particle beamincluding ions and neutral particles of impurity are irradiated to asemiconductor substrate installed at an irradiation position and animpurity of implantation amount D per unit area is implanted to thesemiconductor substrate, the method comprising: irradiating the particlebeam to a particle amount measurement device comprising an electrongeneration/discharging device which is installed nearby the irradiationposition in a state where the semiconductor substrate is not irradiatedby particle beam and which generates and amplifies electronscorresponding to an incident position of ions and neutral particlesincident to a measurement surface and discharges the electrons from backsurface side, an electron detector for measuring a position and anamount of electrons discharged from the electron generation/dischargingdevice, and a particle amount calculation section for calculating adistribution of total particle amount of ions and neutral particlesincident to a surface of the particle detector from positions and amountof electrons measured by the electron detector and irradiating theparticle beam and to a beam current measurement device installed at aposition different from the irradiation position for measuring currentby the ions; finding an ion amount N₂ per unit area incident to the beamcurrent measurement device from a current measured by the beam currentmeasurement device as well as measuring total amount of particles N ofions and neutral particles incident to unit area of the measurementsurface by the particle amount measurement device; finding conversionvalue D₂=D×(N₂/N) from the total amount of particles N, the amount ofions N₂ and the amount of impurity D; installing the semiconductorsubstrate to the irradiation position; irradiating particle beam to thesemiconductor substrate to implanted an impurity into the semiconductorsubstrate; measuring a current due to the ions by the beam currentmeasurement device during implantation of the impurity and finding theamount of ions N_(2′) from measured current; and terminating theimplantation of the impurity when the amount of ions N_(2′) and theconversion value D₂ become equal to each other.

(12) According to one aspect of the present invention, there is provideda stencil mask comprising a silicon thin film in which an opening isformed, wherein an impurity is implanted into a surface of the siliconthin film.

(13) According to one aspect of the present invention, there is provideda stencil mask comprising: a metal thin film in which an opening isformed; a semiconductor layer formed on a surface of the metal thinfilm.

(14) According to one aspect of the present invention, there is provideda stencil mask comprising: a thin film in which an opening is formed;and a plurality of covering layers formed on a surface of the thin film.

(15) According to one aspect of the present invention, there is provideda stencil mask which used for an ion implantation process using asilicon thin film in which an opening is formed, wherein an insulatinglayer is formed on a surface of the silicon thin film.

(16) According to one aspect of the present invention, there is provideda stencil mask comprising: a thin film in which an opening through whichcharged particles pass is provided; and a resist film formed on anirradiation surface of the thin film on which the charged particles areirradiated.

(17) According to one aspect of the present invention, there is provideda stencil mask comprising: a thin film in which an opening through whichcharged particles pass is provided, the depth of the opening beingdifferent corresponding to the size of the opening.

(18) According to one aspect of the present invention, there is provideda stencil mask comprising: a thin film in which an opening forselectively irradiating charged particles to a substrate to beprocessed; an insulating layer formed on an irradiation surface of thethin film on which the charged particles are irradiated; and asupporting substrate formed on the thin film and the insulating layerand conductive to the thin film.

(19) According to one aspect of the present invention, there is provideda method for manufacturing a stencil mask, comprising: implanting animpurity into a surface side of a silicon thin film in which an openingis formed; and heating the silicon thin film.

(20) According to one aspect of the present invention, there is provideda method for manufacturing a stencil mask comprising: implanting animpurity into a silicon thin film surface of a SOI substrate in which asupporting substrate, an insulating layer and a silicon thin layer arestacked; patterning the silicon thin film and forming an opening throughwhich the insulating layer is exposed on a bottom of the silicon thinfilm; and removing one portion of the supporting substrate and theinsulating layer and exposing a bottom surface of an opening.

(21) According to one aspect of the present invention, there is provideda method for manufacturing a stencil mask comprising: implanting animpurity into one surface of a silicon substrate; heating the siliconsubstrate; joining a surface to which an impurity is implanted and aninsulating layer formed on a supporting substrate; grinding the siliconsubstrate to form a silicon thin film; patterning the silicon thin filmand forming an opening through which the insulating layer is exposed;implanting an impurity to a surface of the silicon thin film; heatingthe silicon thin film; and removing one portion of the supportingsubstrate and the insulating layer and exposing a bottom surface of theopening.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIGS. 1A to 1C are sectional views illustrating a manufacturing processof a stencil mask according to a first embodiment of the presentinvention;

FIG. 2 is a characteristic view showing the distortion amount of astencil mask with respect to the doping amount of impurities(phosphorus, carbon and nitrogen);

FIG. 3 is a view showing an example in which a stencil mask of the firstembodiment is used in an ion implantation process;

FIGS 4A and 4B are sectional views illustrating a modified example ofthe manufacturing process of a stencil mask of the first embodiment;

FIGS. 5A to 5C are sectional views illustrating a modified example ofthe manufacturing process, of a stencil mask of the first embodiment;

FIGS. 6A to 6E are sectional views illustrating a manufacturing processof a stencil mask according to a second embodiment of the presentinvention;

FIGS. 7A to 7E are sectional views illustrating a manufacturing processof a stencil mask according to a third embodiment of the presentinvention;

FIGS. 8A to 8G are sectional views illustrating a manufacturing processof a stencil mask according to a fourth embodiment of the presentinvention;

FIGS. 9A and 9B are sectional views showing a configuration of a stencilmask according to a fifth embodiment of the present invention;

FIG. 10 is a view showing an example in which the stencil mask of thefifth embodiment of the present invention is used in an ion implantationprocess;

FIGS. 11A to 11C are sectional views showing a configuration of astencil mask according to a sixth embodiment of the present invention;

FIG. 12 is a sectional view showing a configuration of a stencil maskaccording to a seventh embodiment of the present invention;

FIG. 13 is a sectional view showing an example in which the stencil maskof the seventh embodiment of the present invention is used in an ionimplantation process;

FIG. 14 is a sectional view showing a configuration of a stencil maskaccording to an eighth embodiment of the present invention;

FIGS. 15A to 15G are sectional views illustrating a manufacturingprocess of a stencil mask according to a ninth embodiment of the presentinvention and a manufacturing process of a semiconductor using thestencil mask;

FIGS. 16A to 16F are sectional views illustrating a manufacturingprocess of a stencil mask according to a tenth embodiment of the presentinvention;

FIGS. 17A to 17F are sectional views illustrating a manufacturingprocess of a stencil mask according to an eleventh embodiment of thepresent invention;

FIG. 18 is a view showing a manufacturing process of a semiconductordevice using a stencil mask of the eleventh embodiment of the presentinvention;

FIGS. 19A to 19F are sectional views illustrating a manufacturingprocess of a stencil mask according to a twelfth embodiment of thepresent invention;

FIGS. 20A to 20E are sectional views illustrating a manufacturingprocess of a stencil mask according to a thirteenth embodiment of thepresent invention;

FIGS. 21A to 21E are sectional views illustrating a manufacturingprocess of a stencil mask according to a fourteenth embodiment of thepresent invention;

FIG. 22 is a view showing a manufacturing process of a semiconductordevice using a stencil mask of the fourteenth embodiment of the presentinvention;

FIGS. 23A to 23G are sectional views illustrating a manufacturingprocess of a stencil mask according to a fifteenth embodiment of thepresent invention;

FIGS. 24A to 24F are sectional views illustrating a manufacturingprocess of a stencil mask according to a sixteenth embodiment of thepresent invention;

FIGS. 25A to 25F are sectional views illustrating a manufacturingprocess of a stencil mask according to a seventeenth embodiment of thepresent invention;

FIG. 26 is a schematic diagram of a configuration illustrating an ionimplantation process using a stencil mask according to an eighteenthembodiment of the present invention;

FIG. 27 is a graph showing a measurement result of the residual electriccharge density of a semiconductor substrate after ion implantation.

FIG. 28 is a graph showing measurement results of the residual electriccharge density of a semiconductor substrate, after an ion implantationis performed by changing a distance between the semiconductor substrateand a stencil mask to be 150 μm and the potential difference to be 4 to10 V;

FIG. 29 is a graph showing the distance dependency between a stencilmask and the substrate to be processed with respect to the residualelectric charge amount;

FIG. 30 is a graph showing the potential difference and distancedependency between a semiconductor substrate and a stencil mask withrespect to the residual electric charge amount;

FIG. 31 is a diagram showing a modified example of an ion implantationprocess of the eighteenth embodiment of the present invention;

FIG. 32 is a diagram showing a modified embodiment of the ionimplantation process according to the eighteenth embodiment of thepresent invention;

FIG. 33 is a schematic diagram showing a configuration of apparatus formanufacturing a semiconductor device according to a nineteenthembodiment of the present invention;

FIG. 34 is a schematic diagram showing a configuration of a particleamount measurement device according to the nineteenth embodiment of thepresent invention;

FIG. 35 is a flowchart for illustrating a manufacturing process of asemiconductor device according to the nineteenth embodiment of thepresent invention;

FIG. 36 is a flowchart for illustrating a manufacturing process of asemiconductor device according to a twentieth embodiment of the presentinvention;

FIG. 37 is a schematic diagram showing a configuration of a particleamount measurement device according to a twenty-first embodiment of thepresent invention;

FIG. 38 is a schematic diagram showing a configuration of a particleamount measurement device according to a twenty-second embodiment of thepresent invention; and

FIG. 39 is a diagram showing a state of affairs in which an ionimplantation process is performed using a conventional stencil mask.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, embodiments of the present invention will be described withreference to the drawings.

FIRST EMBODIMENT

FIGS. 1A to 1C are sectional views illustrating a manufacturing processof a stencil mask according to a first embodiment of the presentinvention.

As shown in FIG. 1A, a stencil mask comprising a silicon thin film 103having an opening 104 in a shape of predetermined transmission holepattern is prepared. Reference numeral 101 denotes a silicon supportingsubstrate, reference numeral 102 denotes a silicon oxide film, andreference numeral 103 denotes a silicon thin film having a thickness of5 to 20 μm.

Subsequently, as shown in FIG. 1B, impurity atoms such as a p-typeimpurity, an n-type impurity, carbon, nitrogen and the like areimplanted into the surface side of the silicon thin film by employing anion implantation method. A damaged region 105 is formed on a surface ofa silicon layer by implantation of the impurity atoms. Where an impurityis implanted into the surface on which ions are irradiated when it isused as a stencil mask.

In the case of a stencil mask used in the ion implantation process, itis preferable to implant, if possible, the identical impurity of theidentical electrically conductive impurity so that it is distributeddeeper than doped in a silicon thin film at the time of ion implantationprocess. Since the depth to which ions are implanted is 0.1 to 1 μm inthe ion implantation process, the depth in the silicon layer to which animpurity atom is implanted may be on the order of 0.1 to 1 μm. Forexample, an implantation is performed in the implantation amount of P,which is equal to more than 1×10¹⁴ cm⁻².

Subsequently, as shown in FIG. 1C, after a stencil mask is heated at550° C. for 1 hour, the temperature is raised at the rate of the orderof 10° C./min. up to 900 to 1000° C., the heat is performed from about30 minutes to about 1 hour. By this heating processing, the damagedregion 105 is recrystallized, and a solid silicon layer 106 that is moresolid than a silicon to which an impurity atom is not implanted isformed.

FIG. 2 shows a distortion amount of each mask to which the heatprocessing is performed after impurities (phosphorus, carbon andnitrogen) are doped in the surface of the silicon thin film 103. In FIG.2, a distortion amount of a conventional mask to which the impuritydoping and heat processing are not performed is also shown.

In FIG. 2, a distortion amount of the mask with respect to the amount ofion implantation at the time of ion implantation is shown. As shown inFIG. 2, it is possible that the critical ion implantation amount atwhich the distortion is generated is made larger by one or more placesfrom the conventional value of 1×10¹⁵ cm⁻² by performing this hardeningprocessing.

However, in the case where a hardening layer is formed by doping oxygen,since a problem is generated that thermal energy accumulated in astencil mask is not easily escaped due to the lowering of the heatconductivity, it is necessary to set implantation current density loweror reinforce the cooling of the substrate.

As shown in FIG. 3, when using a stencil mask formed in the abovedescribed processes, when an impurity ion 304 is implanted into a Sisubstrate 301 on which an isolation region 302 is formed through anopening of the silicon thin film 103 set interspatially, since thedistortion is not generated in the silicon thin film 103, the positionof the opening is not displaced and an ion implantation region 305 isformed on the whole desired region.

Moreover, it is possible to use it by performing the mask distortionrelaxation a plurality of times by this heat processing after a stencilmask is used.

The damaged region 405 to which an impurity is implanted from the backsurface (FIG. 4A), a hard silicon layer 406 to which an impurity isimplanted by performing the heat processing may be formed and the hardsilicon layers 106 and 406 may be formed on both surfaces (FIG. 4B).

Moreover, as shown in FIGS. 5A and 5B, a damaged region 504 is formed byperforming an oblique ion implantation. Then, as shown in FIG. 5C, ahard silicon layer 506 of a side wall of the opening 104 may be formedby performing the heat processing described above. A stencil mask whosestrength is higher than a stencil mask whose surface of the shieldingportion of the stencil mask is solely hardened is formed by constructinga structure whose side wall is also hardened.

SECOND EMBODIMENT

In the present embodiment, a manufacturing process of a stencil maskdifferent from that of the first embodiment will be described below.FIGS. 6A to 6E are sectional views illustrating a manufacturing processof a stencil mask according to a second embodiment of the presentinvention.

As shown in FIG. 6A, the silicon thin film 103 formed via a siliconoxide film 102 on a supporting substrate 101 made of silicon ispatterned, and an opening 104 having a predetermined pattern is formed.The surface of the silicon oxide film 102 is exposed to the bottomsurface of this opening 104. Subsequently, as shown in FIG. 6B, animpurity atom is implanted into the surface of the silicon thin film103, and a damaged region 605 is formed.

Subsequently, as shown in FIG. 6C, after the heating is performed at thetemperature of 550° C. for about 1 hour, the temperature is raised atthe rising temperature rate of the order of 10° C./min. up to 900 to1000° C., the damaged region 605 is recrystallized by performing theheating for about 30 minutes to about 1 hour, and a hard silicon layer606 is formed.

Subsequently, as shown in FIG. 6D, the silicon supporting substrate 101and the silicon oxide film 102 are etched, and the bottom surface of theopening 104 is exposed. Since the surface of the silicon thin film 103to be a stencil mask is hardened, the damaging of the silicon thin film103 can be reduced in the etching processing of the silicon supportingsubstrate 101 and the silicon oxide film 102, therefore a stencil maskwhich is cheaper and thinner can be manufactured. Moreover, when theactual ion implantation process is used, the deformation of the stencilmask is reduced.

Subsequently, as shown in FIG. 6E, after an impurity atom is implantedfrom the side of the supporting substrate 101 into the surface of thesilicon thin film 103, following the heating at the temperature of 550°C. for about 1 hour, the temperature is raised at the temperature risingrate of the order of 10° C. min. up to 900 to 1000° C., and the heatingis performed from about 30 minutes to about 1 hour, thereby a hardsilicon layer 106 is formed. According to the above-described processes,a stencil mask is formed.

As described above, according to the present embodiment, since thesurface of the silicon thin film is hard before the removal of thesupporting substrate and the silicon oxide film, the failure of thesilicon thin film can be reduced.

In the present embodiment, although the surface of the silicon thin filmon the side of ion implantation is further formed, it is possible toomit its formation.

THIRD EMBODIMENT

In the present embodiment, a manufacturing process of a stencil maskdifferent from those of the first and second embodiment will bedescribed below. FIGS. 7A to 7E are sectional views illustrating amanufacturing process of a stencil mask according to a third embodimentof the present invention.

First, as shown in FIG. 7A, an impurity atom is implanted into a surfaceof a silicon thin film 103 formed via a silicon oxide film 102 on asupporting substrate 101 made of silicon, and a damaged region 105 isformed. Subsequently, as shown in FIG. 7B, after the heating isperformed at the temperature of 550° C. for about 1 hour, thetemperature is raised at the temperature rising rate of the order of 10°C./min. up to 900 to 1000° C., the heating is performed from about 30minutes to about 1 hour, thereby recrystallizing the damaged region 105and forming a hard silicon layer 106.

Subsequently, as shown in FIG. 7C, the hard silicon layer 106 and thesilicon thin film 103 are patterned, an opening 104 of a predeterminedpattern is formed. The silicon oxide film 103 is exposed to the bottomsurface of the opening 104.

Subsequently, as shown in FIG. 7D, the silicon supporting substrate 101and the silicon oxide film 102 are etched and the bottom surface of theopening 104 is exposed. Since the surface of the silicon thin film 103to be a stencil mask is hardened, the damaging of the silicon thin film103 can be reduced in the etching processing of the silicon supportingsubstrate 101 and the silicon oxide film 102, therefore a stencil maskwhich is cheaper and thinner can be manufactured. Moreover, also at thetime when it is used for the actual ion implantation process, thedeformation of the mask is reduced.

Subsequently, as shown in FIG. 7E, after an impurity atom is implantedfrom the side of the supporting substrate 101 into the surface of thesilicon thin film 103, following the heating at the temperature of 550°C. for about 1 hour, the temperature is raised at the temperature risingrate of the order of 10° C./min. up to 900 to 1000° C., and the heatingis performed from about 30 minutes to about 1 hour, thereby a hardsilicon layer 106 is formed. According to the above-described processes,a stencil mask is formed.

As described above, according to the present embodiment, since thesurface of the silicon thin film is hard before the removal of thesupporting substrate and the silicon oxide film, the failure of thesilicon thin film can be reduced.

In the present embodiment, although the surface of the silicon thin filmon the side of ion implantation is further formed, it is possible toomit its formation.

FOURTH EMBODIMENT

A manufacturing process of a stencil mask of the present embodiment willbe described below using FIGS. 8A to 8G. FIGS. 8A to 8G are sectionalviews illustrating a manufacturing process of a stencil mask accordingto a fourth embodiment of the present invention.

First, as shown in FIG. 8A, an impurity atom is implanted into one ofthe surfaces of a silicon substrate 801 using an ion implantationmethod. A first damaged region 805 is formed by implanting an impurityatom.

Subsequently, as shown in FIG. 8B, after the heating is performed at thetemperature of 550° C. for about 1 hour, the temperature is raised atthe temperature rising rate of the order of 10° C./min. up to 900 to1000° C., the heating is performed from about 30 minutes to about 1hour, thereby recrystallizing a first damaged region 705 and forming afirst hard silicon layer 806 into which an impurity atom is implanted.

Subsequently, as shown in FIG. 8C, a first hard silicon layer 806 of thesilicon substrate 801 and a silicon oxide film 102 formed on a siliconsupporting substrate 101 are plastered.

Subsequently, as shown in FIG. 8D, the silicon substrate 801 is etchedand a silicon thin film 103 having a film thickness of the order of 5 to20 μm is formed.

Subsequently, as shown in FIG. 8E, the silicon thin film 103 ispatterned and an opening 104 of a pattern for ion implantation isformed. Subsequently, as shown in FIG. 8F, an impurity atom is implantedinto the surface of the silicon thin film 103 by the ion implantedmethod. A second damaged region 105 is formed on the surface of thesilicon thin film 103 by an impurity atom implantation. Subsequently,after the heating is performed at the temperature of 550° C. for about 1hour, the temperature is raised at the temperature rising rate of theorder of 10° C./min. up to 900 to 1000° C., the heating is performedfrom about 30 minutes to about 1 hour, thereby recrystallizing thesecond damaged region 105 and forming a hard silicon layer 106 intowhich an impurity atom is implanted.

Subsequently, as shown in FIG. 8G, a stencil mask is formed by removingthe silicon supporting substrate 101 and the silicon oxide film 102.

The entire silicon thin film may be hardened if the depth of ionimplantation into the silicon substrate has been previously made equalto more than the thickness of the layer to be thinned.

FIFTH EMBODIMENT

FIGS. 9A and 9B are sectional views showing a configuration of a stencilmask according to a fifth embodiment of the present invention.

As shown in FIG. 9A, for a stencil mask 1000, a surface of a siliconthin film 103 having an opening pattern 1004 for ion implantation formedby the known manufacturing process is covered by the silicon nitridefilm (covering layer) 1001.

As shown in FIG. 10, in the case where the stencil mask 1000 is used inthe ion implantation process applied to a semiconductor substrate 1101,shielded ions are accumulated in the silicon nitride film 1001. Thestencil mask is deformed by performing an ion implantation, but in thisstructure, damages promoting the deformation to the silicon nitride film1001 and ions implanted as impurities are accumulated.

Now, in a structure of the present invention, damages due to the ionimplantation process and impurities implanted can be selectively removedby selectively removing the silicon nitride film 1001 covering thesurface from the silicon thin film 103 which is present inside (FIG.9B). Then, by covering again the silicon thin film 103 with the siliconnitride film 1001, the original stencil mask is generated and can bereturned to the original state shown in FIG. 9A.

According to the present embodiment, since a silicon nitride film whichis harder than silicon is formed on the surface of the silicon thinfilm, even if the ion beam is irradiated, it is not easily to bedeformed. Moreover, it can be reproduced by selectively removing thesilicon nitride film into which the damage is introduced at the time ofthe ion implantation process and again covering the surface of thesilicon thin film.

-   -   Now, it is desired that the film thickness of the silicon        nitride film 1001 covering the silicon thin film 103 is made a        film thickness within which the shielded implantation ion        remains in the silicon nitride film 1001, it may be decided        corresponding to the acceleration energy of ion and the like.

It is possible to employ an insulator except for silicon nitride film.However, it is preferable that it is an insulator including silicon forthe purpose of preventing a semiconductor device from being polluted.

SIXTH EMBODIMENT

FIGS. 11A to 11C are sectional views showing a configuration of astencil mask according to a sixth embodiment of the present invention.In FIGS. 11A to 11C, the identical reference numerals are attached tothe identical sites with those of FIGS. 9A and 9B, and its descriptionis omitted.

In the present embodiment, as shown in FIG. 11A, a surface of a siliconnitride film 1001 is covered with a tungsten 1002. Since the tungsten1002 has a higher electrical conductivity, it can prevent a stencil maskfrom electrification by the shielded ion charge at the time when the ionimplantation is performed. Moreover, similarly to the fifth embodiment,the tungsten 1002 of the surface can be selectively removed from thesilicon nitride film 1001 (FIG. 11B). Moreover, the silicon nitride film1001 can be also selectively removed from a silicon thin film 103 whichexists inside (FIG. 11C). After removing the coated film, a stencil maskcan be also reproduced similarly to the fifth embodiment.

According to the present embodiment, since a silicon nitride film whichis harder than silicon is formed on the surface of the silicon thinfilm, it is not easily deformed. Moreover, it can be reproduced byselectively removing the silicon nitride film into which the damages areintroduced at the time of performing ion implantation process and againcovering on the surface of the silicon thin film. Moreover, a stencilmask can be prevented from being electrified by covering the metal filmon the outermost surface.

Now, although the combination of the covering film and the mask materialwhich exists inside is not limited to this, it is desired for thepurpose of preventing the accumulation of electric charge that one ofthem has a higher electric conductivity comparing to the other.

SEVENTH EMBODIMENT

FIG. 12 is a sectional view showing a configuration of a stencil maskaccording to a seventh embodiment of the present invention.

As shown in FIG. 12, a surface of a tungsten thin film 1201 having athickness of the order of 5 to 20 μm on which the pattern for ionimplantation is formed is covered by a nitride titanium 1202 and asilicon layer 1203.

The tungsten thin film can be processed using the known technologiesusing photolithography technology and anisotropy etching similarly tothe processing of the silicon thin film of the above embodiment.Moreover, the nitride titanium 1202 and the silicon layer 1203 can beformed using the known technologies such as a CVD method and the like.The nitride titanium 1202 prevents the reaction between the tungstenthin film 1201 and the silicon layer 1203.

A stencil mask 1200 whose core is the tungsten thin film 1201 isenhanced than one whose core is silicon in the viewpoint of the strengthagainst the deformation. As shown in FIG. 13, in the case where thestencil mask 1200 is used in the ion implantation process applied to asemiconductor substrate 1401, the tungsten thin film 1201 can beprevented from being spattered with the ion accelerated by the siliconfilm 1203 covering the surface of the tungsten thin film 1201, and thesemiconductor substrate 1401 can be prevented from being polluted by thetungsten.

Moreover, since the electric conductivity of the tungsten thin film 1201which exists inside, a stencil mask can be prevented from beingelectrified by the charge of the shielded ion at the time of performingthe ion implantation as well as the strength of the mask can be enhancedin the structure of the present embodiment at the same time.

In the case of the present embodiment, after a stencil mask is used inthe ion implantation process several times, the silicon layer isselectively removing by etching using fluorine radical and the like, asilicon layer is newly formed by a CVD method, and it may be preparedfor the next ion implantation. The selective removal of Si film becomeseasy by forming a nitride titanium film between the tungsten thin filmand the silicon layer. Except for nitride titanium, Si oxide film, Sinitride film, SiC film and the like may be available.

In order to make the thermal conductivity and the flow of charge better,after an n-type or a p-type impurity is added, a Si film may be heated.

In the case where a stencil mask whose thickness is thinner than 5 to 20μm is processed, except for tungsten, the materials such as SiC, W, Moand the like whose Young' modulus are higher than that of Si may beused. The nitride titanium film is not necessarily required and asilicon layer may be formed directly on the tungsten thin film.

EIGHT EMBODIMENT

Next, an example in which the refining of the opening is performed bycovering the outermost layer while controlling the thickness is shown inFIG. 14. Now, a polysilicon 1301 is formed via a silicon oxide film, asilicon nitride film, a SiC film and the like on a surface of a siliconthin film 103. An opening size a of an opening of the silicon nitridefilm 103 is a processing size which is realized by a photolithographytechnology and an anisotropy etching technology. Furthermore, an openingsize b which is refined and smaller than the size initially opened canbe realized by controlling a film thickness of the polysilicon 1301 andby forming the film. In the present embodiment, although an example inwhich silicon is covered with polysilicon is shown, the material is notlimited to this.

NINTH EMBODIMENT

In the present embodiment, a reproducible stencil mask will be describedbelow similarly to the fifth to seventh embodiments.

A method for manufacturing a stencil mask according to a ninthembodiment of the present invention and a method for manufacturing asemiconductor device using the stencil mask will be described below withreference to FIGS. 15A to 15G.

First, as shown in FIG. 15A, a stencil mask 1600 comprising a shieldingfilm 1601 made of a silicon film on which an opening 1602 through whichan ion beam passes is formed is prepared. The shielding film isconfigured with a silicon thin film.

Subsequently, as shown in FIG. 15B, the ion irradiation surface of thestencil mask 1600, which is previously made faced upward, is fixed on abase 1603 such as an electrostatic chuck or a vacuum chuck and the like.A first resist 1604 is coated and formed on the entire surface of theion irradiation surface of the stencil mask 1600. At this time, thefirst resist 1604 is also embedded into the opening 1602. Although it isconsidered that the first resist 1604 may get into the gap between thebase 1603 and the stencil mask 1600, there is no problem even if itturns to be in such a state. Then, the processing such as a baking orthe like is performed similarly to the conventional method formanufacturing a semiconductor device.

Subsequently, as shown in FIG. 15C, after the stencil mask 1600 isremoved from the base 1603, a light or an electron beam is irradiatedfrom the ion-non-irradiated surface side and the exposure of the firstresist 1604 is performed. Then, the development of the first resist 1604is performed, and an opening is formed on the first resist 1604.

Since in this exposure, the stencil mask 1600 comprising a shieldingfilm 1601 becomes a mask for exposure, the first resist 1604 which islocated in the opening 1602 and on the upper face of the opening 1602 isremoved. If the opening 1602 performs the exposure with a light in therefined pattern such as 0.1 micron, it means to be exposed in the areanearby the light wavelength, and it is possible that the patterncollapse occurs due to the light wave characteristic. Hence, it is moredesirable that the light exposure is done by an electron beam havingsufficiently a short wavelength with respect to the opening 1602.Moreover, in the case where the first resist 1604 within the opening1602 is not entirely removed by performing the exposure once, exposuresand developments may be repeated plural times.

The first resist 1604 within the opening 1602 is capable of beingremoved without the exposure technology. The first resist 1604 withinthe opening 1602 is removed by performing RIE using oxygen plasma fromthe back surface similarly to the above-described exposure. The etchingmask in this RIE is the shielding film 1601 made of silicon constitutingthe stencil mask 1600, however, since silicon is little etched by oxygenplasma and it damages the shielding film 1601 scarcely at all, there isno problem.

Subsequently, as shown in FIG. 15D, an ion beam 1605 is irradiated to asemiconductor substrate 1606 via the stencil mask 1600 where the firstresist 1064 is formed on the ion beam irradiation surface, and the ionbeam is selectively irradiated to the semiconductor substrate 1606. Ionsimplanted as impurities are accumulated on the first resist 1604 byirradiating the ion beam 1605. Using this stencil mask, the ion beamirradiations are performed once or more.

Subsequently, after ions were accumulated on the first resist 1604, asshown in FIG. 15E, the first resist 1604 covering the upper surface ofthe stencil mask 1600 is incinerated by oxygen plasma and the like andselectively removed. Damages due to the ion implantation process andimpurities implanted can be removed by selectively removing the firstresist 1604.

Subsequently, as shown in FIG. 15F, a second resist 1607 is formed onthe ion irradiation surface of the stencil mask 1600 using the processpreviously described above.

Then, as shown in FIG. 15G, an ion implantation is performed using thestencil mask 1600 on which the second resist 1607 is formed.

Although the formations and removals of the resist to the stencil maskare performed two times in the above-described description, these arenot limited to two times, the formation and removals of the resist canbe performed any given times.

If the method for manufacturing a semiconductor device described aboveis used, the ion implantation process can be performed withoutdistortion of the stencil mask any given times.

As described above, a group of devices performing a process of forming astencil mask, that is, a resist coating device, a device for exposingthe back surface or a device for performing a RIE to the back surfaceusing oxygen plasma and a developing device are stored within thestencil mask ion implantation device, and further, a device for peelinga resist, concretely, a resist incinerating device using oxygen plasmaand a chemical processing device for resolving a resist are also storedwithin the stencil mask ion implantation device. In this way, when astencil ion implantation is performed, two or more sheets of stencilmasks are prepared, at the time when one of the sheets is performing thestencil ion implantation, the other stencil mask is performing peelingof the deteriorated resist by ion implantation of the impurities and aresist film is formed again by the above-described method. Then, whenthe resist is deteriorated by the ion implantation of the impurities,the ion implantation is performed using the other stencil mask preparedin advance. Owing to this, the stencil ion implantation process iscapable of being performed without stopping.

TENTH EMBODIMENT

Conventionally, a stencil mask is formed using a SOI substrate. The SOIsubstrate is more expensive than a silicon wafer in bulk. As a result,the manufacturing cost of a stencil mask has been raised. In the presentembodiment, a method for manufacturing a stencil mask capable oflowering the manufacturing cost thereof by forming a stencil mask usinga silicon wafer in bulk will be described below.

A method for manufacturing a stencil mask according to a tenthembodiment of the present invention will be described below using thesectional views illustrating the process shown in FIGS. 16A to 16F.

As shown in FIG. 16A, a silicon substrate 1901 to be a supportingportion of a stencil mask is prepared. Subsequently, as shown in FIG.16B, a SiO₂ film 1902 is formed, which is to be a stopper at the timewhen the pattern processing of an opening of the stencil mask isperformed later and at the time when the supporting portion of the basksurface is opened later.

Subsequently, as shown in FIG. 16C, an amorphous silicon 1903 isdeposited as a thin film portion material in a desired thickness on theSiO₂ film 1902. Subsequently, as shown in FIG. 16D, the opening 1904 towhich the SiO₂ film 1902 is exposed is formed on the amorphous silicon1903. Later, an ion beam passes through the opening 1904.

Subsequently, as shown in FIG. 16E, after a mask 1905 is formed on theback surface of the silicon substrate 1901, the silicon substrate 1901is etched and the SiO₂ film 1902 is exposed. Subsequently, as shown inFIG. 16F, after a mask 1905 is removed, the SiO₂ film to be exposed isetched.

As for the stencil mask thus prepared, the stencil mask can bemanufactured in a cheaper cost than a stencil mask manufactured using a.SOI substrate. Herein, the present embodiment has been described usingthe combination of the silicon substrate 1901, the SiO₂ film 1902 andthe amorphous silicon 1903 as a substrate to be a supporting portion, astopper film, and a thin film portion material, however, the combinationis not limited to this. Any combination may be available in which theselectivity involving with the mask exists and the pattern formationability of the thin film portion is secured in the process of openingthe pattern (FIG. 16D) and the process of etching the back surface(FIGS. 16E and 16F).

ELEVENTH EMBODIMENT

By enhancing the strength of a stencil mask, the durability can beenhanced and the life can be enhanced. There is a method of thickeningthe film thickness for the purpose of enhancing the strength of astencil mask. However, since conventionally a stencil mask is made usinga SOI substrate, the film thickness is limited to a single filmthickness. On the other hand, the precision of the fine processing of astencil mask depends on the material of the film to be processed and thefilm thickness, and in general, what is called an aspect ratio, that is,the ratio of the opening size and the depth direction. Therefore, for astencil mask using a SOI substrate made of a silicon single crystalline,from the request of the fine processing, the thickness is limited, andthe mask strength is insufficient.

Therefore, in the present embodiment, a method for manufacturing astencil mask capable of realizing both fine processing and enhancementof strength by changing the film thickness of the surrounding siliconfilm corresponding to the size of the opening through which an ion beampasses will be described below. The phrase “changing the film thicknessof the surrounding silicon film corresponding to the largeness of theopening” could be said in other words by the phrase “the changing thedepth of the opening”.

FIGS. 17A to 17F are sectional views illustrating a manufacturingprocess of a stencil mask according to an eleventh embodiment of thepresent invention.

First, as shown in FIG. 17A, a silicon substrate 2001 in bulk isprepared. A resist 2002 having an opening in the region in which thefilm thickness is desired to thicken among the thin film portion of thestencil mask is formed on the silicon substrate 2001. Subsequently, asshown in FIG. 17B, the silicon substrate 2001 is selectively etchedusing the resist 2002 as a mask and a concave portion 2003 is formed onthe silicon substrate 2001. Any of methods of an isotropy etching, achemical processing and a CDE method corresponding to the width of theboundary between the region in which the film thickness is thickened andthe region in which the film thickness is relatively thinner may beused. The depth of etching performed at this time is the difference offilm thickness of the shielding film.

Subsequently, as shown in FIG. 17C, after the resist 2002 is removed, astopper film 2004 such as a silicon oxide film and the like are formedon the silicon substrate. Subsequently, as shown in FIG. 17D, a thinfilm portion material 2005 is formed as a film on the stopper film 2004.

Subsequently, to as shown in FIG. 17E, using a flattening technologysuch as a CMP and the like, the thickness of the thin film portionmaterial 2005 is made to be a desired thickness as well as the surfaceof the thin film portion material 2005 is flattened. The CMP process maybe stably performed by previously melting the surface with a heatprocessing in a high temperature before performing the CMP and enhancingthe flatness of the surface.

Subsequently, as shown in FIG. 17F, a patterning process and a thinningfilm by etching the back surface are performed similarly to theconventional mask. By the process described above up to this point, astencil mask having openings of different depths corresponding to thesize of the openings can be manufactured.

As described above, a stencil mask in which both processing precision ofthe fine processing and strength of the mask are realized by making thedepth be shallower in the case of the smaller opening to which the fineprocessing is required, and making the depth be deeper in the case ofthe other region to which the fine processing is not required. Since itis formed of a silicon substrate in bulk, the manufacturing cost of astencil mask can be lowered.

A manufacturing process of a semiconductor device using this stencilmask is shown in FIG. 18. As shown in FIG. 18, by irradiating an ionbeam 2102 to a semiconductor substrate 2101 via a stencil mask, an ionimplantation region 2103 can be formed in the lower portion of anopening 2006.

As described above, the durability of the stencil mask is high and themanufacturing cost is low. Therefore, the manufacturing cost of asemiconductor device can be lowered by applying a stencil mask to amanufacturing for a semiconductor device.

TWELFTH EMBODIMENT

A method for manufacturing a stencil mask in which depth of an openingis different corresponding to the largeness will be described withreference to FIGS. 19A to 19F. FIGS. 19A to 19F are sectional viewsillustrating a manufacturing process of a stencil mask according to atwelfth embodiment of the present invention.

First, as shown in FIG. 19A, a silicon oxide film 2202 is formed on asilicon substrate 2201 to be a substrate. Next, a resist 2203 having anopening in the desired region in which the film thickness is thickenedamong the thin film portion of the stencil mask is formed on the siliconoxide film 2202. Subsequently, as shown in FIG. 19B, the silicon oxidefilm 2202 is selectively etched by making a resist 2203 as a mask, andan opening 2204 to which the silicon substrate 2001 is exposed isformed. Then, the resist 2203 is selectively removed.

Subsequently, as shown in FIG. 19C, a single crystal silicon film 2205is selectively epitaxially grown on the surface of the silicon substrate2201 exposed to the opening 2204. The film thickness of the singlecrystal silicon film 2205 is the difference of the film thickness.Therefore, the single crystal silicon film 2205 is grown until thenecessary film thickness (film thickness difference) is obtained.

Subsequently, as shown in FIG. 19D, after the silicon oxide film 2202 isselectively removed, a stopper film 2206 is formed on the surface of thesilicon substrate 2201 and the single crystal silicon film 2205. Beforethe stopper film 2206 is formed, the silicon oxide film 2202 might notbe removed. Next, a thin film portion material 2207 is formed on thestopper film 2206 such as the silicon oxide film and the like.

Subsequently, as shown in FIG. 19E, the thickness of the thin filmportion material 2207 is made into a desired thickness as well as thesurface of the thin film portion material 2207 is flattened usingflattering technologies such as a CMP and the like.

Subsequently, as shown in FIG. 19F, when a pattern processing similar tothe conventional stencil mask and a thinning by etching on the backsurface are performed, the film thickness of the thin film portionmaterial 2207 has a plurality of film thicknesses, a stencil mask inwhich depth of the opening is different corresponding to the size can bemanufactured.

As described above, a stencil mask in which both processing precision ofthe fine processing and strength of the mask are realized by making thedepth be shallower in the case of the smaller opening to which the fineprocessing is required, and making the depth be deeper in the case ofthe other region to which the fine processing is not required. Since itis formed of a silicon wafer in bulk, the manufacturing cost of astencil mask can be lowered.

Similarly to the eleventh embodiment, the manufacturing cost of asemiconductor device can be lowered by applying a stencil mask to themanufacturing for a semiconductor.

THIRTEENTH EMBODIMENT

A method for manufacturing a stencil mask in which depth of an openingis different corresponding to the largeness will be described withrespect to FIGS. 20A to 20E. FIGS. 20A to 20E are sectional viewsillustrating a method of a manufacturing process of a stencil maskaccording to a twelfth embodiment of the present invention.

First, as shown in FIG. 20A, a single crystalline silicon substrate 2301in bulk as a substrate material for manufacturing a stencil mask isprepared. Subsequently, as shown in FIG. 20B, a mask 2302 is formed inthe desired region to be relatively thinned among the thin film portionof the silicon substrate 2301. The mask 2302 can be formed byselectively epitaxially growing a silicon thin film, for example, usinga resist film as a mask. This mask 2302 is formed in order to reduce therate of oxygen ion at the time of oxygen ion implantation later.

Subsequently, as shown in FIG. 20C, in a state where a mask 2302 isformed, oxygen ions are uniformly implanted into the in-plane at thedesired energy, an etching stopper 2303 is formed, and the siliconsubstrate 2301 is divided into a silicon thin film portion 2305 and asupporting substrate portion 2304. The etching stopper 2303 of theformation region of the mask 2302 is formed in a shallower shape thatthe region in which the mask is not formed, and the film thickness ofthe silicon thin film portion 2305 is thinner that the other regions.

Subsequently, as shown in FIG. 20D, the mask 2302 formed on the surfaceof silicon thin film portion 2305 is removed by the CMP method and thelike.

Subsequently, as shown in FIG. 20E, according to a process similar tothe conventional one, after an opening 2306 to which the etching stopper2303 is exposed is formed on the predetermined region of the siliconthin film portion, the supporting substrate portion 2304 and the etchingstopper 2303 which are unnecessary regions are removed, and a stencilmask is formed.

According to the process described above, a stencil mask in which thethickness of the silicon thin film portion 2305 is varied and depth ofthe opening 2306 is different corresponding to the largeness can bemanufactured. A stencil mask is capable of being manufactured while thestrength of the entire mask is maintained by thinning the film thicknessin the region where the refined processing is required. Moreover, sinceit is formed from the silicon substrate 2301 in bulk, the manufacturingcost of a stencil mask can be lowered.

Similarly to the eleventh embodiment, the manufacturing cost of asemiconductor device can be lowered by applying a stencil mask to themanufacturing process of a semiconductor device.

According to the necessity, after the oxygen ion implantation isperformed, the defect made in the film may be recovered by performingthe heating processing. Moreover, after an ion implantation or after anion implantation and a heat processing, the film thickness of thesilicon thin film portion-2305 may be increased by the procedures suchas epitaxial growth method and the like.

FOURTEENTH EMBODIMENT

If electric charge of ions shielded with a stencil mask is accumulatedon a stencil mask in an ion implantation process, there is a problemthat a discharging phenomenon between a non-processing substrate and thestencil mask occurs or the stencil mask is moved toward thenon-processed substrate by electrostatic force and the stencil mask isdeformed. If the deformed stencil mask is used, since the patternformation ability is lowered, non-defective ratio of the manufacturedsemiconductor device is lowered, and as a result, the manufacturing costof the semiconductor device is raised.

At the time of ion implantation, since the ion implantation is performedin a state of the thin film side is made faced downward, and the gapbetween the thin film and the semiconductor substrate is on the order of100 μm, it is difficult to ground the thin film and discharge theelectric charge.

In the present embodiment, a stencil mask capable of efficientlydischarging the electric charge from the stencil mask will be describedbelow.

FIGS. 21A to 21E are sectional views illustrating a manufacturingprocess of a stencil mask according to a fourteenth embodiment of thepresent invention.

First, as shown in FIG. 21A, a silicon substrate 2401 in bulk isprepared. Subsequently, as shown in FIG. 21B, a shielding member 2402 isinstalled in the region for shielding implantation ion of the siliconsubstrate 2401. At this time, the shielding member 2402 is installed sothat implantation ions are necessarily formed in the region where thefilm thin portion of the stencil mask is formed. As for the region whereions are implanted, it is desirable that an ion implantation isperformed in a region of the order of 100 μm to 10 mm wider as one sidethan the region opened by the back side surface etching in order to havea process margin of the back side surface etching. As a shieldingmember, it may be a thick resist mask formed using a lithographytechnology, or a glass mask, a silicon mask and the like in which thedesired region is opened have been previously made, and this may beutilized.

Subsequently, as shown in FIG. 21C, an oxide film 2403 to be an etchingstopper is formed by implanting an oxygen ion into the silicon substrate2401, and the silicon substrate 2401 is divided into a silicon thin filmportion 2405 and a supporting substrate portion 2304. Since oxygen ionsare not implanted into the silicon substrate 2401 below the shieldingmember 2402, the silicon thin film portion 2405 and the supportingsubstrate portion 2404 are electrically conductive to each other.

Subsequently, as shown in FIG. 21D, the shielding member 2402 is removedfrom the surface of the silicon thin film portion 2405. Subsequently, asshown in FIG. 21E, after an opening 2406 is formed similarly to theconventional stencil mask, the thinning is performed by the back sidesurface etching.

As described above, a stencil mask having a higher electric conductivitybetween the silicon thin film portion 2405 and the supporting substrateportion 2404 of the stencil mask can be manufactured. Moreover,according to the necessity, after an ion implantation is performed, thedefect made in the film may be recovered by performing the heatprocessing. Moreover, after an ion implantation is performed or after anion implantation and a heat processing are performed, the film thicknessof the silicon thin film portion 2405 may be increased using theprocedure such as an epitaxial growth and the like.

A manufacturing process of a semiconductor device using the stencil maskis shown in FIG. 22. As shown in FIG. 22, on a semiconductor substrate2501, a stencil mask 2400 fixed by an electrostatic chuck device 2502 ina ring shape is arranged. The electrostatic chuck device 2502 isgrounded and the supporting substrate portion 2404 and the electrostaticchuck device 2502 are electrically conductive to each other.

An ion implantation region 2504 is formed below the opening 2406 byirradiating an ion beam 2503 to the semiconductor substrate 2501 via thestencil mask 2400. At this time, since the silicon thin film portion2405 of the stencil mask 2400, the supporting substrate portion 2404 andthe electrostatic chuck device are electrically connected to each other,and the electrostatic chuck device 2502 is grounded, the electriccharges of the stencil mask 2400 can be efficiently discharged. As aresult, the lowering of the pattern formation ability can be suppresseddue to the deformation of the silicon thin film portion 2405 of thestencil mask 2400. As a result, the non-defective ratio of themanufactured semiconductor device can be prevented, and themanufacturing cost of the semiconductor device can be suppressed.

FIFTEENTH EMBODIMENT

In the present embodiment, a method for manufacturing a stencil maskwhich enhanced the electric conductivity and heat conductivity between asupporting portion and a thin film portion will be described below withreference to FIGS. 23A to 23G. FIGS. 23A to 23G are sectional viewsillustrating a manufacturing process of a stencil mask according to afifteenth embodiment of the present invention.

First, as shown in FIG. 23A, a silicon substrate 2601 in bulk isprepared. Next, a silicon oxide film 2602 is formed on a siliconsubstrate 2601. Subsequently, as shown in FIG. 23C, a resist 2603 isformed in a region except for the region concealed with the supportingportion after the manufacturing of the stencil mask. Subsequently, thesilicon oxide film 2602 is selectively removed by making the resist 2603as a mask. For the removal of the silicon oxide film 2602, in general,it is considered that oxide film is removed by hydrofluoric acid (HF)based chemical processing or the oxide film is removed with a gas basedone using a CDE method and the like, however, any procedure may beavailable.

Subsequently, as shown in FIG. 23E, the resist 2603 is selectivelyremoved. Subsequently, as shown in FIG. 23F, a silicon thin film 2604 tobe a thin film portion is formed on the silicon substrate 2601 and thesilicon oxide film 2602. Subsequently, as shown in FIG. 23G, similarlyto the conventional stencil mask, after an opening 2605 is formed on thesilicon thin film. 2604, the thinning is performed by the back sidesurface etching.

A stencil mask in which the electric conductivity and heat conductivitybetween the supporting portion and the thin film portion are high can bemanufactured by employing the manufacturing process described above.

Similarly to the fourteenth embodiment, the manufacturing cost of asemiconductor device can be lowered by applying a stencil mask to themanufacturing process of a semiconductor device.

SIXTEENTH EMBODIMENT

In the present embodiment, a method for manufacturing a mask in which amaterial of a thin film portion of a stencil mask is made into twolayers structure as well as the electric conductivity and the heatconductivity between a supporting portion and a thin film portion areenhanced will be described below with reference to FIGS. 24A to 24F.FIGS. 24A to 24F are sectional-views illustrating a manufacturingprocess of a stencil mask of the sixteenth embodiment of the presentinvention.

First, a silicon oxide film 2702 whose one portion is opened is formedon a silicon substrate 2701 as shown in FIG. 24A via a similar processwith a series of process described with reference to FIGS. 23A to 23E inthe fifteenth embodiment.

Subsequently, as shown in FIG. 24B, a metal material 2703 and a siliconthin film 2704 are in turn formed on the silicon substrate 2701 and thesilicon oxide film 2702. Subsequently, as shown in FIG. 24C, after aresist 2705 having an opening is formed on the silicon thin film 2704,the silicon thin film 2704 is selectively etched by anisotropy etchingsuch as RIE and the like and an opening 2706 to which the metal material2703 is exposed is formed.

Subsequently, as shown in FIG. 24D, a salicide 2707 is formed byreacting the metal material 2703 and the silicon thin film 2704 byadding the heating processing. At this time, since the metal material2703 in the region where the opening 2706 is formed does not react withthe silicon thin film 2704, it remains as it is.

Subsequently, as shown in FIG. 24E, the remaining metal material 2703 isselectively etched. The metal material 2703 in the formation region ofthe opening 2706, which does not react, can be selectively removed withrespect to the salicide 2707 below the silicon thin film 2704 byperforming a salicide process.

Moreover, in the case where a salicidization is performed by reactingthe metal material 2703 and the silicon thin film 2704, it is desirablethat before the silicon thin film 2704 is deposited, an impurity hasbeen previously implanted into the metal film. A stress occurrenceaccompanying with the volume change at the time of the salicidizationreaction can be relaxed by previously having implanted an impurity intothe metal.

It is not required that the process of salicidization is necessarilyperformed, the metal material 2703 which exposes to the opening may bedirectly removed by employing a chemical resolving metals such assulfuric acid and the like. However, in this case, the metal film of theshielding portion is laterally backed by the film thickness portion. Forexample, in the case where the metal material 2703 in the opening 2706region was removed with 50% margin of the film thickness in a statewhere the metal material 2703 is 100 nm in a thickness formed as a film,the metal material 2703 remains below the silicon thin film 2704 havinga width of 300 nm or more, and below the silicon thin film 2704 having awidth of 300 nm or less, the metal material 2703 is in a state of beingnon-existence.

Subsequently, as shown in FIG. 24F, a stencil mask having the salicide2707 on the surface of the mask can be manufactured by performing thethinning by the back side surface etching similarly to the conventionalstencil mask.

In the case where this stencil mask is used for ion implantation, ifthere would be a problem that the substrate to be processed is pollutedby the metal material being sputtered from the surface, it is possiblethat this problem is solved by forming the film from the material notpolluting the substrate to be processed, such as silicon on the metalsurface.

This stencil mask has the high electrical conductivity and the heatconductivity by having the metal material. Moreover, by having the metalmaterial, its deflection strength is stronger than the time when thethin film portion is formed by only silicon. Since silicon in the thinfilm portion where an opening pattern is formed corresponding to thedeflection strength enhancement can be further thinned, the processingprecision of the refined processing can be enhanced.

Similarly to the fourteenth embodiment, the manufacturing cost of asemiconductor device is capable of being lowered by applying a stencilmask to the manufacturing process of a semiconductor device.

SEVENTEENTH EMBODIMENT

In the present embodiment, a method for manufacturing a stencil mask inwhich a material of a thin film portion of a stencil mask is made intothree-layer structure as well as the electric conductivity and the heatconductivity between a supporting portion and a thin film portion areenhanced will be described below with reference to FIGS. 25A to 25F.FIGS. 25A to 25F are sectional views illustrating a manufacturingprocess of a stencil mask of the seventeenth embodiment of the presentinvention.

First, a silicon oxide film 2802 is formed on a silicon substrate 2801as shown in FIG. 25A via a similar process with a series of processesdescribed with reference to FIGS. 23A to 23E in the fifteenthembodiment.

Subsequently, as shown in FIG. 25B, an amorphous silicon film 2803 as afirst thin film material, a metal material 2804 as a second thin filmmaterial and a silicon thin film 2805 as a third thin film material arein turn formed.

Subsequently, as shown in FIG. 25C, after a resist 2806 having anopening is formed using a lithography technology, the silicon film 2805is selectively etched by anisotropy etching such as RIE and the like andan opening 2707 to which the metal material 2804 is exposed is formed.

Subsequently, as shown in FIG. 25D, the metal material 2804 exposed tothe opening is removed using a chemical resolving a metal such assulfuric acid and the like. Subsequently, as shown in FIG. 25E, theamorphous silicon film 2803 is selectively removed using an anisotropyetching. At this time, the silicon film 2805 which has been alreadypatterned and formed is similarly going to be etched, therefore, it isdesirable that the silicon film 2805 is sufficiently thicker comparingwith the amorphous silicon film 2803.

Subsequently, as shown in FIG. 25F, a stencil mask having the siliconfilm 2805 and also having the metal material 2804 on the surface of themask can be manufactured by performing the thinning by the back sidesurface etching similarly to the conventional stencil mask.

The deflection strength of this stencil mask is stronger than the timewhen the thin film portion is formed with only silicon by having themetal material 2804. Moreover, Since silicon in the thin film portionwhere an opening pattern is formed corresponding to the deflectionstrength enhancement can be further thinned, the processing precision ofthe refined processing can be enhanced.

Similarly to the fourteenth embodiment, the manufacturing cost of asemiconductor device is capable of being lowered by applying a stencilmask to the manufacturing process of a semiconductor. In addition, sinceas to the stencil mask, the silicon film 2805 is formed on the surfaceof the mask, when this stencil mask is used, the semiconductor substrateis prevented from metal pollution and this stencil mask has the highelectric conductivity and the heat conductivity by having the metalmaterial.

EIGHTEENTH EMBODIMENT

In a manufacturing process of a semiconductor using charged particlessuch as an ion implantation, there has been a problem that electriccharges are accumulated on the wafer and the semiconductor elements aredestroyed. A device configuration having a mechanism in which thesecondary electron or plasma electron is generated for the purpose ofsolving this problem, thereby neutralizing the electric charges isgenerally known. However, for this neutralizing mechanism, itsneutralizing amount is varied depending on the state within the devicesuch as the state of a wafer and the state of charged particles ordegree of vacuum and the like. Therefore, because of the shortness ofthe neutralizing amount, or conversely, because of the oversupply of theelectron, a negative electrification occurred, and even the case wherethe semiconductor element has been destroyed has been occurred, andthese have been problems. Moreover, there has been a problem that thedevice was complicated by incorporating such a mechanism into thedevice.

FIG. 26 is a diagram showing an ion implantation process using a stencilmask according to an eighteen embodiment of the present invention.

As shown in FIG. 26, on a semiconductor substrate 2901 into whichcharged particles are implanted, a stencil mask 2902 formed with siliconand having an opening 2903 through which an ion beam 2904 passes isdisposed. The semiconductor substrate 2901 and the stencil mask 2902 areelectrically connected to each other so that a potential differencebetween them becomes constant. The potential difference between thesemiconductor substrate 2901 the stencil mask 2902 is controlled to agiven value in a range of from −20 V to +20 V using an electric source2905 according to the necessity. Out of the range from −20 V to +20 V,the stencil mask and the semiconductor mask and the semiconductorsubstrate may be contacted with each other by Coulomb's force.

The result of measuring the residual electric charge density of thesemiconductor substrate 2901 after the potential difference between thesemiconductor substrate 2901 and the stencil mask 2902 is adjusted to 0V by the electric source 2905 and the ion implantation is performed intothe semiconductor substrate 2901 is shown in FIG. 27. Here, phosphorusions (P⁺) are implanted into an oxide silicon film (SiO₂) formed on a Sisubstrate by changing the acceleration energy. In FIG. 27, the term“without mask” refers to the measured results in the case where the ionimplantation is performed without controlling the potential differencebetween the semiconductor substrate 2901 and the stencil-mask 2902, andthe term “with mask” refers to the measured results in the case wherethe ion implantation is performed by making the distance between thesubstrate to be processed and the stencil mask 100 μm and the potentialdifference is made 0 V. As shown in FIG. 27, it is understood that theresidual electric charges remained on the semiconductor substrate 2901are reduced by controlling the potential difference between thesemiconductor substrate 2901 and the stencil mask 2902.

Moreover, the results of measuring the residual electric charges bymaking the distance between the semiconductor substrate 2901 and thestencil mask 2902 be 150 μm, and the potential difference be 0.1 V isshown in FIG. 28. The phosphorous ions (P+) are implanted into the oxidesilicon film (SiO₂) formed on the Si substrate at the accelerationvoltage 50 keV via the stencil mask.

As shown in FIGS. 27 and 28, in the case where the ion implantation isperformed at the low acceleration energy on the order of 50 keV, theresidual charge is reduced on the order of two places by controlling thepotential difference between the semiconductor substrate 2901 and thestencil mask 2902. Moreover, also in the other energy condition, theresidual electric charge density is closer to 0, and the energydependency also does not exist at all.

Moreover, as shown in FIG. 28, in the case where it is controlled at thepotential difference 0.1 V, the residual electric charge amount can becontrolled at 1×10¹⁰/cm².

The residual electric charge amount can be controlled by controlling thedistance between the semiconductor substrate 2901 and the stencil mask2902 as well as by controlling the potential difference between thesemiconductor substrate 2901 and the stencil mask 2902.

The results of measuring the residual electric charge amount in the casewhere the distance between the stencil mask 2902 and the substrate to beprocessed 2901 is changed in a range of from 100 to 400 μm is shown inFIG. 29. The potential difference between the substrate to be processedand the stencil mask is controlled at 0 V. The other conditions for theion implantation are the same.

FIG. 29 is a graph showing the relationship of distance dependencybetween the residual electric charge amounts of the substrate to beprocessed 2901 and the stencil mask 2902.

From the results showing in FIG. 29, it is determined that the residualcharge can be controlled by changing the distance between thesemiconductor substrate 2901 and the stencil mask 2902. Moreover, if thedistance between the semiconductor substrate 2901 and the stencil mask2902 is set at 100 μm on the basis of the distance dependency of theresidual electric charges, it is understood that it is possible enoughto control the residual electric charge amount to be 5×10¹⁰/cm².

Next, the residual electric charge amount of the substrate to beprocessed is measured in the case where both of the distance and thepotential difference between the semiconductor substrate 2901 and thestencil mask 2902 are changed. The potential difference between thesemiconductor substrate 2901 and the stencil mask 2902 is changed in arange of from −4 V to +10 V, and the distance between the semiconductorsubstrate 2901 and the stencil mask 2902 is changed in a range of from150 μm to 400 μm. The other conditions are the same. The measurementresults are shown in FIG. 30. FIG. 30 is a characteristic view showingthe potential difference and the distance dependency between thesemiconductor substrate 2901 and the stencil mask 2902 with respect tothe residual electric charge amount. From the results shown in FIG. 30,it is understood that the residual electric charge density as anelectric charge amount can be controlled by simultaneously controllingthe potential difference and the distance.

As shown in FIG. 31, except for the electrical source 2905, the stencilmask 2902 and the semiconductor substrate 2901 may be directlyelectrically connected to the outer side wall of the device which isgrounded. In this case, the stencil mask 2902 and the semiconductorsubstrate 2901 can be stably made to be the identical potential level (0V), and further, the potential difference with the outer wall of thedevice can be set to a certain constant, therefore, the amount ofelectrification can be more stably and easily controlled.

Moreover, an example of individually controlling the potential of thesubstrate to be processed and the stencil mask by making the outer wallof the device or ground as reference is shown in FIG. 32. Since at thetime of irradiating an ion beam 3503, the potentials of the outer wallof the device (or ground) and a stencil mask 3502 are individuallycontrolled by an electrical source 3505, and the potentials of the outerwall of the device and a semiconductor substrate 3501 can beindividually controlled, the amount of electrification can be morestably controlled.

NINETEENTH EMBODIMENT

In the present embodiment, a method for manufacturing a semiconductordevice in which the in-plane distribution of the whole particlesincluding in-plane ions and neutral particles is uniformly done, and anirradiation of an ion beam is performed to a semiconductor substratewill be described below.

Prior to the description concerning with the method for manufacturing asemiconductor device, the configuration of the apparatus formanufacturing a semiconductor device will be described below withreference to FIG. 33. FIG. 33 is a diagram showing a schematicconfiguration of a apparatus for manufacturing a semiconductor deviceaccording to a nineteenth embodiment of the present invention.

As shown in FIG. 33, an ion beam 3602 which is generated in an ionsource 3601, accelerated to the desired energy and weight/energyanalyzed and taken out passes through a scanner 3603 and a magnet 3604is formed as the parallel ion beam 3605 having the desired width, andintroduced into an end station portion 3606 for performing an ionimplantation into a semiconductor substrate 3608 internally installed.

Here, a particle amount measurement device 3607 configured by a MCP withfluorescent plate and a CCD camera has been previously installedimmediately below the irradiation position to the semiconductorsubstrate 3608. The spatial distribution of the amount of particlesirradiated on the semiconductor substrate 3608 can be measured byintroducing the parallel ion beam 3605 in a state where thesemiconductor substrate 3608 and the stencil mask 3609 installed on anXY stage 3610 are backed and avoided from the irradiation position.Moreover, a beam current measurement device 3611 for measuring a beamcurrent such as side faraday is provided.

The configuration of the particle amount measurement device 3607 will bedescribed below with reference to FIG. 34. As shown in FIG. 34, aparticle amplification detector 3701 for the secondary electron 3704corresponding to the amount and position of the particles such as anelectric charged particle, a neutral particle, a photon and the likecolliding with the measurement surface is generated, the generatedsecondary electron 3705 is amplified, and outputs a secondary electron3706 from the back surface is provided on the downstream side of theparallel ion beam 3605. As the particle amplification detector 3701, amulti-channel plate and a multi-sphere plate are used. A fluorescentplate 3702 is provided on the downstream side of the secondary electronoutputted from the particle amplification detector 3701. A CCD camera3703 for detecting a strength distribution of a light 3707 emitted bythe fluorescent plate 3702 due to the second electron collision isprovided.

This measurement device 3607 is capable of measuring the two dimensionaldistribution of the amount of particles included in the ion beam bymeasuring a light intensity distribution of the fluorescencecorresponding to the amount of the secondary electrons generated andamplified corresponding to the amount of particles and the collisionposition. Instead of the fluorescent plate 3702 and CCD camera 3703, itis possible that the light-sensitive film is set on the rear surfaceside of the particle amplification detector 3701, after thelight-sensitive film is sensitized by the secondary electron outputtedfrom the particle amplification detector 3701, the distribution of thetotal particle amount incident to the particle amplification detector3701 by developing the sensitive-film.

The distribution of the neutral particles can be also measured byemploying a multi-channel plate and a multi-sphere plate as a particleamplification detector. Therefore, the amount of the particles acting tothe semiconductor substrate can be more precisely measured.

Moreover, a region necessary to be measured can be limited by limitingthe a region in which an ion moves to come into a chip size using astencil mask and the XY stage, and the particle amount measurementdevice 3607 can be easily installed. In the present embodiment, althoughthe particle amount measurement device 3607 is installed below the XYstage 3610 to which a semiconductor substrate is moved, it may beavailable that the particle amount measurement device 3607 is movableand after the measurement is performed, the particle amount measurementdevice 3607 may be backed and avoided from irradiation position at thetime of substrate processing.

A method for manufacturing a semiconductor device using the measurementdevice described above will be described below. FIG. 35 is a flowchartfor illustrating a method for manufacturing a semiconductor deviceaccording to the nineteenth embodiment of the present invention.

(Step S101)

First, a semiconductor substrate is carried in an end station portion3606. A semiconductor substrate 3608 has been previously backed andavoided from the irradiation position within the end station portion3606 but in a turnout position where a parallel ion beam 3605 is notirradiated. The stencil mask 3609 has been also previously backed andavoided from irradiation position in a turnout position. It ispreferable that the adjustment of the parallel ion beam 3605 isperformed immediately before the irradiation of the parallel ion beam3605. Hence, the semiconductor substrate 3608 has been previouslycarried within the end station portion 3606 and is backed and avoidedfrom the irradiation position of the parallel ion beam 3605.

(Step S102)

Subsequently, the parallel ion beam 3605 is irradiated to themeasurement surface of the particle amount measurement device 3607.

(Step S103)

The in-plane distribution of the total particle amount of the ions andneutral particles included in the parallel ion beam 3605 is found by theparticle amount measurement device 3607.

(Step S104)

The ion source 3601, the scanner 3603, and the magnet 3604 are adjustedso that the in-plane distribution of the total particle amount, whichhas been found, is uniform.

(Step S105)

After it is set so that an ion beam is not irradiated to the substrateto be processed by shielding an ion beam with a shutter, or by stoppingthe irradiation of the ion beam, the semiconductor substrate 3608 andthe stencil mask 3609 are moved to the ion beam irradiation position bythe XY stage 3610.

(Step S106)

The parallel ion beam 3605 is irradiated to the semiconductor substrate3608 using the stencil mask 3609, and an impurity is implanted into thesemiconductor substrate 3608.

In the method for manufacturing a semiconductor device described above,after the in-plane distribution of the total particle amount of ions andneutral particles is measured and the ion source 3601, the scanner 3603and the magnet 3604 are adjusted so that the measured in-planedistribution is uniform, the in-plane distribution of the impurityimplanted into the semiconductor substrate 3608 can be uniform byirradiating the parallel ion beam 3605 to the semiconductor substrate3608.

TWENTIETH EMBODIMENT

In an ion implantation process in the manufacturing of semiconductor,since the electric characteristics of a semiconductor element are variedby the variation of the impurity implantation amount, it is required toprecisely measure the amount of impurity implanted into a substrate tobe processed.

When the particle amount measurement device 3607 described in thenineteenth embodiment and a beam current measurement device 3611 arecombined to use, the amount of impurity implanted into the semiconductorsubstrate 3608 is measured in situ, and the variation of the irradiationcan be suppressed.

The desired amount of impurity can be precisely implanted into thesemiconductor substrate 3608 by determining before the processing thecorrelation between the measured value of the particle amountmeasurement device 3607 and the measured value of the beam currentmeasurement device 3611 capable of measuring an ion current during theimplantation processing.

Hereinafter, a method for manufacturing a semiconductor device in whichthe particle amount measurement device 3607 and the beam currentmeasurement device 3611 are combined will be described with reference toFIG. 36. FIG. 36 is a flowchart used for illustrating a manufacturingprocess of a semiconductor device according to a twentieth embodiment ofthe present invention.

(Step S201)

First, a semiconductor substrate 3608 is carried in an end stationportion 3606. The semiconductor substrate 3608 has been previouslybacked and avoided from the irradiation position within the end stationportion 3606 but in a turnout position where a parallel ion beam 3605 isnot irradiated. A stencil mask 3609 has been also previously backed andavoided from the irradiation position in a turnout position. The stateof the parallel ion beam 3605 is changed depending on the environmentwithin the end station portion 3606. Therefore, it is preferable thatthe correlation between the measurement value of the particle amountmeasurement device 3607 and the measurement value of the beam currentmeasurement device 3611 is performed immediately before the irradiationof the parallel ion beam 3605 to the semiconductor substrate 3608.Hence, the semiconductor substrate 3608 has been previously carriedwithin the end station portion 3606 and is backed and avoided from theirradiation position of the parallel ion beam 3605.

(Step S202)

Subsequently, the parallel ion beam 3605 is irradiated to themeasurement surface of the particle amount measurement device 3607.

(Step S203)

The amount of ions N₂ is measured by the beam current measurement device3611 as well as the total amount of the particles N incident to the unitarea of the measured surface by the particle amount measurement device3607 of the present invention immediately before the ion implantation isperformed into the semiconductor substrate 3608. Where instead of theamount of ion N₂ the ion current is measured whenever the occasiondemands during the ion irradiation, and the value may be a value ofwhich the amount of electric current is simply integrated.

(Step S204)

The conversion value D₂=D×(N₂/N) is found using two measured values Nand N₂ with respect to the desired amount of implantation D.

(Step S205)

After the parallel ion beam 3605 is not irradiated to the semiconductorsubstrate 3608 by shielding the parallel ion beam 3605 with a shutter,or by stopping the irradiation of the parallel ion beam 3605 once, thesemiconductor substrate 3608 and the stencil mask 3609 are moved to theion beam irradiation position.

(Step S206)

The parallel ion beam 3605 is selectively irradiated to thesemiconductor substrate 3608 using the stencil mask 3609, and animpurity is implanted into the semiconductor substrate 3608.

(Step S207)

The amount of ion N₂, is measured by the beam current measurement device3611 at the time when an impurity is implanted.

(Step S208)

Whether or not the measured amount of ion N₂, is equal to the conversionvalue D₂ is determined.

(Step S209)

At the time when that the amount of ion N₂, is equal to the conversionvalue D₂ is determined, the ion implantation processing is terminated.

As described above, if the appropriate conversion value D₂ previouslyhave been found immediately before the processing is performed, at thetime when the amount of ion N₂, is the conversion value D₂ at the timeof ion irradiation, the amount of implantation can be preciselycontrolled without depending on the state of device by stopping the ionirradiation processing, and the variation of the electriccharacteristics of the semiconductor element can be suppressed.

As the beam current measurement device 3611 capable of measuring the ioncurrent during the implantation processing, there is, for example, ameasurement device what is called a side faraday. This is to measure theamount of current of a portion of the end of the ion beam spatiallyspread, which does not act to the substrate to be processed.

TWENTY-FIRST EMBODIMENT

Next, an embodiment in which particles and neutral particles having aspecific energy can be solely measured by providing an electrode infront of a particle amount measurement device 3607 will be describedbelow with reference to FIG. 37. As shown in FIG. 38, in front of theparticle amount measurement device 3607, an electrode 3901 capable ofapplying a given potential by an electric source 3902 is installed. In astate of not applying the potential to the electrode 3901, all theparticles included in a parallel ion beam 3605 pass through theelectrode 3901, and the particles 3605′ which have passed through theelectrode 3901 are measured by the particle amount measurement device3607.

Now, assuming that the valence of particle is +q, when a potential E isgiven to the electrode 3901, an ion having a small kinetic energy lessthan qE cannot pass through the electrode 3901. The particles 3605′passing through the electrode 3901 and measured by the particle amountmeasurement device 3607 are neutral particles or its kinetic energybeing exceeded over qE. The state of energy of particles reached to thesemiconductor substrate during the processing can be, confirmed in moredetail by changing the voltages applied to the electrode 3901 and byconfirming the spatial distribution and amount of signals of theparticles 3605′ measured by the particle amount measurement device 3607.

Particularly, in the ion implantation, since the depth of theimplantation depends on the kinetic energy which the particle has(acceleration energy), and the amount of implantation and the depth ofthe implantation have influence on the electric characteristics of thesemiconductor element, the variation of the electric characteristics ofthe semiconductor element can be reduced by confirming the kineticenergy distribution, which the particles have, prior to performing ofthe processing to the semiconductor substrate.

TWENTY-SECOND EMBODIMENT

Next, an embodiment in which, owing to further limiting the positions,the amount of particles can be measured by installing a stencil maskhaving an opening in a specific region will be described below withrespect to FIG. 38.

As shown in FIG. 38, now, in front of a particle amount measurementdevice 3607, a stencil mask 4101 in which an opening 4102 is provided ina given region is installed. Only the particles which have passedthrough the opening 4102 of the stencil mask 4101 are incident to theparticle amount measurement device 3607. Therefore, a measurement whosespatial resolution is higher can be realized by changing the settings ofthe opening size of the opening 4102 of the stencil mask 4101 and thedistance between the openings. Moreover, only the particles having aspecific energy may be measured by applying the potential to thisstencil mask 4101 and utilizing the stencil mask as the electrode 3901described in the Twenty-first embodiment.

The present invention is not limited to the above-described eachembodiment, in the carrying out stage, the present invention is capableof being deformed in a variety of forms in the scope without departingsubject matter thereof. For instance, in the above-described eachembodiment, although a stencil mask is used as a mask at the time of ionimplantation, it is also capable of being used as a mask of etchingusing plasma including charged particles and the like. Moreover, it isalso capable of utilizing as a mask in the X-ray (charged particle)exposure.

Furthermore, the above-described embodiments include inventions in avariety of stages, a variety of inventions are capable of beingextracted by appropriate combinations in a plurality of structuralrequirements disclosed herein. For example, if some of the structuralrequirements are deleted from all the structural requirements indicatedin the embodiments, in the case where at least one of the problemsdescribed in the column of “Problem to be solved by the invention” canbe solved and at least one of the effects described in the column of“Effects of the invention” can be obtained, the structure whosestructural requirements thereof are deleted is capable of beingextracted as the invention.

Additional advantages and modifications will readily occur to thoseskilled in the art. Therefore, the invention in its broader aspects isnot limited to the specific details and representative embodiments shownand described herein. Accordingly, various modifications may be madewithout departing from the spirit or scope of the general inventiveconcept as defined by the appended claims-and their equivalents.

1-22. (canceled)
 23. A stencil mask comprising: a metal thin film inwhich an opening is formed; and a semiconductor layer formed on asurface of the metal thin film.
 24. A stencil mask comprising: a thinfilm in which an opening is formed; and a plurality of covering layersformed on a surface of the thin film.
 25. A stencil mask which used foran ion implantation process using a silicon thin film in which anopening is formed, wherein an insulating layer is formed on a surface ofthe silicon thin film.
 26. A stencil mask comprising: a thin film inwhich an opening through which charged particles pass is provided; and aresist film formed on an irradiation surface of the thin film on whichthe charged particles are irradiated. 27-31. (canceled)